4th International Through-life Engineering Services Conference
3rd & 4th November 2015
Cranfield University, UK
About the Conference
The conference will be hosted at Cranfield on the 3rd and 4th November 2015. The proceedings for TESConf 2014 are online now
Successful high technology UK manufacturing companies are offering a range of interlinked high value products and through-life engineering services. These high value products are typically technology intensive, expensive and reliability critical requiring cost effective and value led services (such as maintenance, repair and overhaul) throughout the life cycle.
The EPSRC Centre for Innovative Manufacturing in Through-life Engineering Services is delighted to announce the third International Conference in this vital area. Through-lie Engineering Services typically now generates 50 - 60% of the revenue in many companies and the opportunities for industry in the future are set to expand and become a major part of those that want to survive in the 21st Century. The service that is needed will involve manufacturers taking more whole life service responsibilities than they have in the past as users seek to find solutions to smooth their in-year costs and reduce overheads.
The Conference brings experts and researchers in this area together to exchange ideas and progress in providing solutions to provide world-class capability to enable industry to deliver high value products with outstanding availability, predictability and reliability with the lowest life cycle cost. This event is sponsored by CIRP.
Call for Industrial Exhibition
Organisations around the world are invited to book a stand to exhibit their products and services in through-life engineering services. The conference will allow the organisations to show case their exhibits in front of their potential customers and network with world-class academics for future collaboration.
The conference is organised by the EPSRC Centre for Through-life Engineering Services.
TESConf 2015 is proud to announce that the IMS Centre of the University of Cincinnati
is the Technical Co-Sponsor of the 4th Internation Conference!